OUHEP ATLAS PIXEL FLEX HYBRID MODULE AND DEMONSTRATOR DESIGNS

Glossary

 

Base design for Flex Hybrid version 1.x, 13 July, 1999


Final layout for CERN Process 1 (SBU) 7 July 1998

(Hold down the shift key and left click on a link to force Netscape or Mosaic to save to a file)

Layout seperated by layers and labled for signal tracing

(Plot bottom layer on opaque media, top and reference layers on transparent media)

Glossary

COF - Chips on Flex, a product of GE Corporate Research and Development and
Lockheed-Martin. Metal on Kapton interconnect layers are built directly onto IC die, eliminating the need for wire bonds or other connections between the die and other components included on the circuit.

design rules - minimum dimesions of circuit features allowed in a fabrication process.

FCB - Flexible Circuit Board.

FE - Front End IC.

GE - General Electric Corporation.

MCC - Module Control Chip, a.k.a Master Clock and Control chip.

MCCM - MCC module.

standard design rules - 100 micron traces, 100 micron spaces, 400 micron via holes and 800 micron via cover pads.

GE design rules - 25 micron traces, 42.5 micron spaces, 25 micron via holes and square, 75 micron via cover pads.


This page is maintained by Rusty Boyd.

Disclaimer

This page last updated 13 July, 1999.