OUHEP ATLAS PIXEL FLEX HYBRID MODULE AND DEMONSTRATOR
Base design for Flex Hybrid version 1.x, 13 July, 1999
Design files for quotation development
Final layout for CERN Process 1 (SBU) 7 July 1998
(Hold down the shift key and left click
on a link to force Netscape or Mosaic to save to a file)
Layout seperated by layers and labled for signal tracing
(Plot bottom layer on opaque media, top and reference layers on transparent
COF - Chips on Flex, a product of GE
Corporate Research and Development and
Lockheed-Martin. Metal on Kapton
interconnect layers are built directly onto IC die, eliminating the need
for wire bonds or other connections between the die and other components
included on the circuit.
design rules - minimum dimesions
of circuit features allowed in a fabrication process.
FCB - Flexible Circuit Board.
FE - Front End IC.
GE - General Electric Corporation.
MCC - Module Control Chip, a.k.a
Master Clock and Control chip.
MCCM - MCC module.
standard design rules - 100 micron
traces, 100 micron spaces, 400 micron via holes and 800 micron via cover
GE design rules - 25 micron traces,
42.5 micron spaces, 25 micron via holes and square, 75 micron via cover
This page is maintained by Rusty
This page last updated 13 July,